Electromigration in sputtered copper films on polyimide
| dc.citation.epage | 271 | en_US |
| dc.citation.issue | 4 | en_US |
| dc.citation.spage | 267 | en_US |
| dc.citation.volume | 10 | en_US |
| dc.citation.woscount | 12 | |
| dc.contributor.author | Wang, HW | en_US |
| dc.contributor.author | Chiou, BS | en_US |
| dc.contributor.author | Jiang, JS | en_US |
| dc.contributor.department | 電子物理學系 | zh_TW |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electrophysics | en_US |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:46:34Z | |
| dc.date.available | 2014-12-08T15:46:34Z | |
| dc.date.issued | 1999-06-01 | en_US |
| dc.description.abstract | Electromigration damage (EMD) is one of the major causes for the failures of interconnects. In this study, the electromigration of Cu on polyimide is investigated. An empirical formula is used to evaluate the EMD of Cu film. The activation energy (Q) obtained is significantly less than those of lattice and grain boundary diffusion. This suggests that the electromigration in copper proceeds via an interfacial diffusion path. The geometry of the metallization also affects the activation energy. Any abrupt change in the interconnect direction and metal width causes current crowding and should be avoided. The current exponents (n), calculated from EMD data, are 3.58 and 3.35 for straight and zig-zag Cu films, respectively. | en_US |
| dc.identifier.doi | 10.1023/A:1008964516337 | en_US |
| dc.identifier.issn | 0957-4522 | en_US |
| dc.identifier.journal | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1023/A:1008964516337 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/31314 | |
| dc.identifier.wosnumber | WOS:000081340300004 | |
| dc.language.iso | en_US | en_US |
| dc.title | Electromigration in sputtered copper films on polyimide | en_US |
| dc.type | Article | en_US |