Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design
| dc.citation.epage | 867 | en_US |
| dc.citation.issue | 8 | en_US |
| dc.citation.spage | 865 | en_US |
| dc.citation.volume | 35 | en_US |
| dc.citation.woscount | 0 | |
| dc.contributor.author | Shih, Jian-Yu | en_US |
| dc.contributor.author | Chen, Yen-Chi | en_US |
| dc.contributor.author | Chiu, Chih-Hung | en_US |
| dc.contributor.author | Chen, Kuan-Neng | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:36:50Z | |
| dc.date.available | 2014-12-08T15:36:50Z | |
| dc.date.issued | 2014-08-01 | en_US |
| dc.description.abstract | Motional resistance of TSV-based resonator devices with 3D integration techniques is investigated at the operating oscillating mode. Even with well-developed TSV and device fabrication, the motional resistance issue of the TSV-based resonator device is found due to the poor connected Ag paste. The corresponding solution is demonstrated by a modified concave Cu TSVs structure. This modified concave Cu TSV design shows the excellent device characteristics and no visible gaps between the Cu TSVs and resonator devices to insure a good electrical connection. | en_US |
| dc.identifier.doi | 10.1109/LED.2014.2327117 | en_US |
| dc.identifier.issn | 0741-3106 | en_US |
| dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/LED.2014.2327117 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/25228 | |
| dc.identifier.wosnumber | WOS:000341573000019 | |
| dc.language.iso | en_US | en_US |
| dc.subject | Three-dimensional (3D) integration | en_US |
| dc.subject | concave through silicon via (TSV) | en_US |
| dc.subject | motional resistance | en_US |
| dc.title | Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design | en_US |
| dc.type | Article | en_US |