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Locating Damage Using Integrated Global-Local Approach with Wireless Sensing System and Single-Chip Impedance Measurement Device

dc.citation.woscount0
dc.contributor.authorLin, Tzu-Hsuanen_US
dc.contributor.authorLu, Yung-Chien_US
dc.contributor.authorHung, Shih-Linen_US
dc.contributor.department土木工程學系zh_TW
dc.contributor.departmentDepartment of Civil Engineeringen_US
dc.date.accessioned2014-12-08T15:35:09Z
dc.date.available2014-12-08T15:35:09Z
dc.date.issued2014en_US
dc.description.abstractThis study developed an integrated global-local approach for locating damage on building structures. A damage detection approach with a novel embedded frequency response function damage index (NEFDI) was proposed and embedded in the Imote2.NET-based wireless structural health monitoring (SHM) system to locate global damage. Local damage is then identified using an electromechanical impedance-(EMI-) based damage detection method. The electromechanical impedance was measured using a single-chip impedance measurement device which has the advantages of small size, low cost, and portability. The feasibility of the proposed damage detection scheme was studied with reference to a numerical example of a six-storey shear plane frame structure and a small-scale experimental steel frame. Numerical and experimental analysis using the integrated global-local SHM approach reveals that, after NEFDI indicates the approximate location of a damaged area, the EMI-based damage detection approach can then identify the detailed damage location in the structure of the building.en_US
dc.identifier.doi10.1155/2014/729027en_US
dc.identifier.issn1537-744Xen_US
dc.identifier.journalSCIENTIFIC WORLD JOURNALen_US
dc.identifier.urihttp://dx.doi.org/10.1155/2014/729027en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/23860
dc.identifier.wosnumberWOS:000331898900001
dc.language.isoen_USen_US
dc.titleLocating Damage Using Integrated Global-Local Approach with Wireless Sensing System and Single-Chip Impedance Measurement Deviceen_US
dc.typeArticleen_US

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