銅化學氣相沈積技術及在深次微米積體電路之應用研究(II)

dc.contributor.author	陳茂傑	en_US
dc.contributor.department	交通大學電子工程系	zh_TW
dc.date.accessioned	2014-12-13T10:37:18Z
dc.date.available	2014-12-13T10:37:18Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-2215-E009-044	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=444194&docId=80440	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94531
dc.language.iso	zh_TW	en_US
dc.subject	銅化學氣相沈積法	zh_TW
dc.subject	深次微米	zh_TW
dc.subject	積體電路	zh_TW
dc.subject	擴散障礙	zh_TW
dc.subject	鈍化	zh_TW
dc.subject	Cu-CVD	en_US
dc.subject	Deep submicrometer	en_US
dc.subject	IC	en_US
dc.subject	Diffusion barrier	en_US
dc.subject	Passivation	en_US
dc.title	銅化學氣相沈積技術及在深次微米積體電路之應用研究(II)	zh_TW
dc.title	Cu-CVD Technology and Reliability Issues of Cu Metallization Relevant to ULSI Application(II)	en_US
dc.type	Plan	en_US

Files

Now showing 1 - 1 of 1