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Etching of GaN by microwave plasma of hydrogen

dc.citation.epageen_US
dc.citation.issue3en_US
dc.citation.volume25en_US
dc.citation.woscount1
dc.contributor.authorTiwari, Rajanish N.en_US
dc.contributor.authorChang, Lien_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:07:16Z
dc.date.available2014-12-08T15:07:16Z
dc.date.issued2010-03-04en_US
dc.description.abstractAn etching process for GaN on a sapphire substrate using a microwave plasma of hydrogen has been studied. Scanning electron microscopy observations of the surface morphology show that the etching of GaN with H(2) plasma can lead to the formation of etch pits in hexagonal shape. The average size of hexagonal pits is greater than 200 nm. The effects of processing pressure and etching time are demonstrated.en_US
dc.identifier.doi10.1088/0268-1242/25/3/035010en_US
dc.identifier.issn0268-1242en_US
dc.identifier.journalSEMICONDUCTOR SCIENCE AND TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1088/0268-1242/25/3/035010en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/5736
dc.identifier.wosnumberWOS:000274318300023
dc.language.isoen_USen_US
dc.titleEtching of GaN by microwave plasma of hydrogenen_US
dc.typeArticleen_US

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