高性能材料之銲接與修補製程最佳化研究---子計畫三：凝膠法製備低介電係數材料之特性提升研究(II)
| dc.contributor.author | 謝宗雍 | en_US |
| dc.contributor.author | HSIEH TSUNG-EONG | en_US |
| dc.contributor.department | 國立交通大學材料科學與工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:36:05Z | |
| dc.date.available | 2014-12-13T10:36:05Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2216-E009-039 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=584716&docId=109912 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/93775 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 高性能材料之銲接與修補製程最佳化研究---子計畫三：凝膠法製備低介電係數材料之特性提升研究(II) | zh_TW |
| dc.title | Property Enhancement of Low Dielectric Constant Material Prepared by Sol-Gel Process(II) | en_US |
| dc.type | Plan | en_US |
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