銅化學氣相沈積技術及積體電路銅製程相關的材料與製程技術研究

dc.contributor.author	陳茂傑	en_US
dc.contributor.department	交通大學電子工程系	zh_TW
dc.date.accessioned	2014-12-13T10:34:35Z
dc.date.available	2014-12-13T10:34:35Z
dc.date.issued	2000	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC89-2215-E009-029	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=528098&docId=96282	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/92852
dc.language.iso	zh_TW	en_US
dc.subject	銅化學氣相沈積	zh_TW
dc.subject	孔槽填充技術	zh_TW
dc.subject	銅﹧介電材料系統之熱穩定性	zh_TW
dc.subject	鉭基障礙層	zh_TW
dc.subject	銅膜表面鈍化	zh_TW
dc.subject	Cu-CVD	en_US
dc.subject	Via/trench filling	en_US
dc.subject	Thermal stability of Cu/dielectric	en_US
dc.subject	Ta-based barrier	en_US
dc.subject	Passivation of Cu	en_US
dc.title	銅化學氣相沈積技術及積體電路銅製程相關的材料與製程技術研究	zh_TW
dc.title	Cu-CVD Technology and Reliability Issues of Cu Metallization Relevant to ULSI Application	en_US
dc.type	Plan	en_US

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