Al(2)O(3)/Ga(2)O(3)(Gd(2)O(3)) passivation on In(0.20)Ga(0.80)As/GaAs-structural intactness with high-temperature annealing

Abstract

Molecular beam epitaxy grown Al(2)O(3)/Ga(2)O(3)(Gd(2)O(3))/In(0.20)Ga(0.80)As/GaAs has been rapidly thermal annealed to 850 degrees C in N(2). The hetero-structure remained intact, with the In(0.20)Ga(0.80)As/GaAs interface being free of misfit dislocation and In(0.20)Ga(0.80)As strained, as observed by high-resolution transmission electron microscopy and high-resolution x-ray diffraction using synchrotron radiation. Excellent capacitance-voltage characteristics as well as low electrical leakages were obtained. These structural and electrical results demonstrate that employing Ga(2)O(3)(Gd(2)O(3)) as a dielectric with an in situ Al(2)O(3) capping layer efficiently protects strained InGaAs layers from relaxing and volatilizing during rapid thermal annealing to 850 degrees C, important for fabricating inversion-channel InGaAs metal-oxide-semiconductor field-effect-transistors, a candidate for beyond the 16 nm node complementary MOS technology.