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Aluminum incorporation into AlGaN grown by low-pressure metal organic vapor phase epitaxy

dc.citation.epageen_US
dc.citation.issue10en_US
dc.citation.volume99en_US
dc.citation.woscount3
dc.contributor.authorHuang, GSen_US
dc.contributor.authorYao, HHen_US
dc.contributor.authorLu, TCen_US
dc.contributor.authorKuo, HCen_US
dc.contributor.authorWang, SCen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:16:34Z
dc.date.available2014-12-08T15:16:34Z
dc.date.issued2006-05-15en_US
dc.description.abstractAluminum (Al) incorporation in AlxGa1-xN films grown by low-pressure metal organic vapor phase epitaxy using trimethylaluminum (TMAl) and trimethylgallium as group III precursors has been systematically studied. The solid phase Al composition of the AlxGa1-xN films varied nonlinearly with the Al gas phase composition. The incorporation kinetics of AlxGa1-xN alloy has been analyzed by using an adsorption-trapping model. Two parameters were used to characterize the properties of Al incorporation, i.e., the capture radius and the adsorption time of Al atoms. An exponential function of the Al composition of the AlxGa1-xN films versus the TMAl gas flow rate was obtained. It was demonstrated that the adsorption time of the Al atom was larger than the growth time of one atomic layer. The effects of ammonia flow rate, crystal growth rate, and growth temperature on the adsorption parameters were also discussed. (c) 2006 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2199972en_US
dc.identifier.issn0021-8979en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2199972en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12243
dc.identifier.wosnumberWOS:000237943800058
dc.language.isoen_USen_US
dc.titleAluminum incorporation into AlGaN grown by low-pressure metal organic vapor phase epitaxyen_US
dc.typeArticleen_US

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