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Laser Lift-Off Mechanisms of GaN Epi-Layer Grown on Pattern Sapphire Substrate

dc.citation.epageR22en_US
dc.citation.spageR20en_US
dc.citation.woscount0en_US
dc.contributor.authorChang, Tai-Minen_US
dc.contributor.authorFang, Hsin-Kaien_US
dc.contributor.authorLiao, Chengen_US
dc.contributor.authorHsu, Wen-Yangen_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2015-07-21T08:29:03Z
dc.date.available2015-07-21T08:29:03Z
dc.date.issued2015-01-01en_US
dc.description.abstractWafer bonding and laser lift-off (LLO) processes were employed to fabricate pattern sapphire thin-GaN light-emitting diodes LEDs (PT-LED). During the LLO process, the required laser energy for PT-LED was much higher than that for flat thin-GaN LED (FT-LED). The yield rate of PT-LED was low, and the leakage current was high. In this study, the laser lift-off mechanisms of PT-LEDs were investigated. (C) The Author(s) 2014. Published by ECS. All rights reserved.en_US
dc.identifier.doi10.1149/2.0101502jssen_US
dc.identifier.issn2162-8769en_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0101502jssen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/124225
dc.identifier.wosnumberWOS:000348412100015en_US
dc.language.isoen_USen_US
dc.titleLaser Lift-Off Mechanisms of GaN Epi-Layer Grown on Pattern Sapphire Substrateen_US
dc.typeArticleen_US

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