單晶片系統驗證之核心技術開發---子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(III)
| dc.contributor.author | 李育民 | en_US |
| dc.contributor.author | LEE YU-MIN | en_US |
| dc.contributor.department | 國立交通大學電信工程學系(所) | zh_TW |
| dc.date.accessioned | 2014-12-13T10:51:52Z | |
| dc.date.available | 2014-12-13T10:51:52Z | |
| dc.date.issued | 2007 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC96-2220-E009-012 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1462772&docId=262096 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/102954 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 單晶片系統驗證之核心技術開發---子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(III) | zh_TW |
| dc.title | Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs(III) | en_US |
| dc.type | Plan | en_US |