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Stress reduction of (111) homoepitaxial diamond films on nickel-coated substrate

dc.citation.epage362en_US
dc.citation.spage358en_US
dc.citation.volume259en_US
dc.citation.woscount0en_US
dc.contributor.authorChiu, Kun-Anen_US
dc.contributor.authorTian, Jr-Shengen_US
dc.contributor.authorWu, Yue-Hanen_US
dc.contributor.authorPeng, Chun-Yenen_US
dc.contributor.authorChang, Lien_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2015-07-21T11:20:49Z
dc.date.available2015-07-21T11:20:49Z
dc.date.issued2014-11-25en_US
dc.description.abstractCrack-free (111) homoepitaxial diamond films were grown on Ni-coated diamond substrates by microwave plasma chemical vapor deposition. After diamond deposition, the Ni islands with a size of 50-1000 nm were formed and embedded underneath the diamond films. The tensile stress in the diamond films evaluated with micro-Raman spectroscopy can be significantly reduced with the embedded Ni islands, which allows the growth of similar to 5 mu m thick crack-free (111) homoepitaxial diamond films with a good quality, compared with those directly deposited on substrates without coating. (c) 2014 Elsevier B.V. All rights reserved.en_US
dc.identifier.doi10.1016/j.surfcoat.2014.03.012en_US
dc.identifier.issn0257-8972en_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.surfcoat.2014.03.012en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/124277
dc.identifier.wosnumberWOS:000347589900039en_US
dc.language.isoen_USen_US
dc.subjectHomoepitaxial growthen_US
dc.subjectDiamonden_US
dc.subjectNickelen_US
dc.subjectCVDen_US
dc.titleStress reduction of (111) homoepitaxial diamond films on nickel-coated substrateen_US
dc.typeArticleen_US

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