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Epitaxial growth of the GaN film by remote-plasma metalorganic chemical vapor deposition

dc.citation.epage5469en_US
dc.citation.issue10en_US
dc.citation.spage5465en_US
dc.citation.volume37en_US
dc.citation.woscount1
dc.contributor.authorLai, WCen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorYokoyama, Men_US
dc.contributor.authorGuo, JDen_US
dc.contributor.authorTsang, JSen_US
dc.contributor.authorChan, SHen_US
dc.contributor.authorBow, JSen_US
dc.contributor.authorWei, SCen_US
dc.contributor.authorHong, RHen_US
dc.contributor.authorSze, SMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:47:36Z
dc.date.available2014-12-08T15:47:36Z
dc.date.issued1998-10-01en_US
dc.description.abstractGaN films were successfully grown by the remote-plasma metalorganic chemical vapor deposition (RPMOCVD) system. The composition of the GaN films could be tuned from nitrogen-rich to stoichiometric growth by varying the mole flow rate of trimethylgallium (TMGa). A hypothesis concerning the collisions between excited nitrogen and TMGa was also brought up. The collision between excited nitrogen and TMGa influences the characteristics of surface morphology, composition, growth rate, and growth mechanism. The characteristics of the GaN film were optimized by changing the growth conditions. The narrowest FWHM of the double-crystal X-ray rocking curve is about 0.2 degrees. Under optimized conditions, the composition of the GaN film is almost the same as that of the reference GaN film grown by MOCVD.en_US
dc.identifier.issn0021-4922en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/31858
dc.identifier.wosnumberWOS:000076630000006
dc.language.isoen_USen_US
dc.subjectremote plasmaen_US
dc.subjectMOCVDen_US
dc.subjectstoichiometric growthen_US
dc.titleEpitaxial growth of the GaN film by remote-plasma metalorganic chemical vapor depositionen_US
dc.typeArticleen_US

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