<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css">

A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection

Thumbnail Image

Date

1995

Authors





Journal Title

Journal ISSN

Volume Title

Publisher

DOI

Abstract

Description

Keywords

Citation

URI

https://ir.lib.nycu.edu.tw/handle/11536/19961

Collections

會議論文;;Conferences Paper

Endorsement

Review

Supplemented By

Referenced By