A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection

Title:	A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection
Authors:	Sun, SC Tsai, MH Chiu, HT Chuang, SH Tsai, CE 奈米中心 Nano Facility Center
Issue Date:	1995
URI:	http://hdl.handle.net/11536/19961
ISBN:	0-7803-2700-4
Journal:	INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST
Begin Page:	461
End Page:	464
Appears in Collections:	Conferences Paper