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The system-on-chip design of a silicon micromachined condenser microphone array

dc.citation.epage312en_US
dc.citation.issue1en_US
dc.citation.spage303en_US
dc.citation.volume116en_US
dc.citation.woscount0
dc.contributor.authorBai, MSRen_US
dc.contributor.authorHuang, SWen_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.date.accessioned2014-12-08T15:38:54Z
dc.date.available2014-12-08T15:38:54Z
dc.date.issued2004-07-01en_US
dc.description.abstractA miniature condenser microphone array that combines array signal processing and micro-electro-mechanical systems (MEMS) technologies is presented. A linear dynamic model and a quasistatic analysis are presented. The array configuration serves two purposes: enhancement of the signal-to-noise ratio (SNR) and the directivity of sensor. A least-squares beamforming design based on the template resulting from the Multiple Signals Classification algorithm is proposed to achieve a directive beam pattern. To minimize the parasitic effects on the MEMS device, a system-on-chip design composed of a microphone module, a dc bias circuit, an impedance matching circuit, and array beamforming filters is proposed in the paper. The performance of the proposed design is evaluated in terms of the frequency response, SNR improvement, and directional response through numerical simulations and experiments. (C) 2004 Acoustical Society of America.en_US
dc.identifier.doi10.1121/1.1753295en_US
dc.identifier.issn0001-4966en_US
dc.identifier.journalJOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICAen_US
dc.identifier.urihttp://dx.doi.org/10.1121/1.1753295en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/26637
dc.identifier.wosnumberWOS:000222674800031
dc.language.isoen_USen_US
dc.titleThe system-on-chip design of a silicon micromachined condenser microphone arrayen_US
dc.typeArticleen_US

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