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The Effect of Al and Ni Top Electrodes in Resistive Switching Behaviors of Yb2O3-Based Memory Cells

dc.citation.epageP25en_US
dc.citation.issue2en_US
dc.citation.spageP22en_US
dc.citation.volume1en_US
dc.citation.woscount1
dc.contributor.authorMondal, Somnathen_US
dc.contributor.authorHer, Jim-Longen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorPan, Tung-Mingen_US
dc.contributor.department生物科技學系zh_TW
dc.contributor.departmentDepartment of Biological Science and Technologyen_US
dc.date.accessioned2014-12-08T15:30:31Z
dc.date.available2014-12-08T15:30:31Z
dc.date.issued2012en_US
dc.description.abstractIn this letter, the effect of Al and Ni top electrodes in resistive switching behavior of Al/Yb2O3/TaN and Ni/Yb2O3/TaN memory devices is proposed. The Al/Yb2O3/TaN memory device demonstrates no such switching performance as applying bias on both top and bottom electrodes, whereas the Ni/Yb2O3/TaN reveals the bipolar memory switching behavior with a high resistance ratio of 10(4) for over 200 cycles of switching responses and good data retention with memory window of about 10(5) at 85 degrees C, as extrapolated up to 10 years. The resistance switching dynamic is ascribed to the conductivity modulation by oxygen ions/vacancies controlled electrochemical reaction process in the Yb2O3 switching layer. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.005202ssl] All rights reserved.en_US
dc.identifier.doi10.1149/2.005202sslen_US
dc.identifier.issn2162-8742en_US
dc.identifier.journalECS SOLID STATE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.005202sslen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/21799
dc.identifier.wosnumberWOS:000318339500009
dc.language.isoen_USen_US
dc.titleThe Effect of Al and Ni Top Electrodes in Resistive Switching Behaviors of Yb2O3-Based Memory Cellsen_US
dc.typeArticleen_US

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