<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Electrical resistivities and thermopowers of transparent Sn-doped indium oxide films

dc.citation.epage5920en_US
dc.citation.issue10en_US
dc.citation.spage5918en_US
dc.citation.volume96en_US
dc.citation.woscount48
dc.contributor.authorLi, ZQen_US
dc.contributor.authorLin, JJen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.department物理研究所zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.contributor.departmentInstitute of Physicsen_US
dc.date.accessioned2014-12-08T15:37:18Z
dc.date.available2014-12-08T15:37:18Z
dc.date.issued2004-11-15en_US
dc.description.abstractWe have systematically measured the electrical resistivities and thermopowers of transparent tin-doped indium oxide films. We found that the resistivities obey the Bloch-Gruneisen law between 25 and 300 K, whereas below 25 K, the resistivities slightly increase logarithmically with the decreasing temperature due to the weak-localization and electron-electron interaction effects. The thermopowers are negative and decrease linearly with temperature from 300 K down to 1.8 K. Our results strongly indicate that the tin-doped indium oxide films behave as a good, free-electron-like conductor while being transparent. (C) 2004 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.1801153en_US
dc.identifier.issn0021-8979en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1801153en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/25635
dc.identifier.wosnumberWOS:000224926000088
dc.language.isoen_USen_US
dc.titleElectrical resistivities and thermopowers of transparent Sn-doped indium oxide filmsen_US
dc.typeArticleen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
000224926000088.pdf
Size:
199.45 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: