Extraction of electrical mechanisms of low-dielectric constant material MSZ for interconnect applications (Vol 447, pg 516, 2004)
| dc.citation.epage | 342 | en_US |
| dc.citation.issue | 1-2 | en_US |
| dc.citation.spage | 342 | en_US |
| dc.citation.volume | 467 | en_US |
| dc.citation.woscount | 0 | |
| dc.contributor.author | Chang, TC | en_US |
| dc.contributor.author | Yan, ST | en_US |
| dc.contributor.author | Liu, PT | en_US |
| dc.contributor.author | Lin, ZW | en_US |
| dc.contributor.author | Aoki, H | en_US |
| dc.contributor.author | Sze, SM | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:37:17Z | |
| dc.date.available | 2014-12-08T15:37:17Z | |
| dc.date.issued | 2004-11-22 | en_US |
| dc.identifier.doi | 10.1016/j.tsf.2004.05.002 | en_US |
| dc.identifier.issn | 0040-6090 | en_US |
| dc.identifier.journal | THIN SOLID FILMS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/j.tsf.2004.05.002 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/25630 | |
| dc.identifier.wosnumber | WOS:000224185100055 | |
| dc.language.iso | en_US | en_US |
| dc.title | Extraction of electrical mechanisms of low-dielectric constant material MSZ for interconnect applications (Vol 447, pg 516, 2004) | en_US |
| dc.type | Correction | en_US |