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Memory effect of oxide/oxygen-incorporated silicon carbide/oxide sandwiched structure

dc.citation.epageG147en_US
dc.citation.issue2en_US
dc.citation.spageG144en_US
dc.citation.volume152en_US
dc.citation.woscount2
dc.contributor.authorChang, TCen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorYan, STen_US
dc.contributor.authorYang, FMen_US
dc.contributor.authorSze, SMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:37:01Z
dc.date.available2014-12-08T15:37:01Z
dc.date.issued2005en_US
dc.description.abstractThe memory effects of the oxide/oxygen-incorporated silicon carbide (SiC :O)/oxide sandwiched structure were investigated. The memory window is decreased with the increasing of the oxygen content in the SiC :O film due to the reduction of dangling bonds. A concise model is proposed to explain the reduction of dangling bonds with increasing oxygen content. Also, a higher breakdown voltage is observed with less oxygen content in the SiC :O film, which is attributed to the high barrier height induced by electron trapping in the SiC :O film. (C) 2005 The Electrochemical Society.en_US
dc.identifier.doi10.1149/1.1850859en_US
dc.identifier.issn0013-4651en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1850859en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/25434
dc.identifier.wosnumberWOS:000227142400066
dc.language.isoen_USen_US
dc.titleMemory effect of oxide/oxygen-incorporated silicon carbide/oxide sandwiched structureen_US
dc.typeArticleen_US

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