<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

An efficient transient modeling for 3-D multilevel interconnections in a stratified dielectric medium

dc.citation.epage1891en_US
dc.citation.issue10en_US
dc.citation.spage1881en_US
dc.citation.volume42en_US
dc.citation.woscount0
dc.contributor.authorWu, CYen_US
dc.contributor.authorHou, HMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:47:36Z
dc.date.available2014-12-08T15:47:36Z
dc.date.issued1998-10-01en_US
dc.description.abstractAn efficient method is presented to model the transient characteristics of distributed resistor-capacitor of ULSI multilevel interconnections on complex topography, in which the reformulation of the boundary-element method (BEM) associated with the Padi-via-Lanczos (PVL) algorithm can avoid the redundant works on both volume mesh and transient analysis associated with the finite-difference method. An adaptive multilayer closed-form spatial Green's function for BEM is developed to examine the voltage and current responses of the multilevel conductor system by using the boundary-element method of integral formulation, in which arbitrary triangular elements on the surface of conductors are used to efficiently calculate the free-charge distributions of complex structure based on actual topography/processes. Applying the Galerkin principle over boundary elements, all of the surface integrals of charge distribution have been discretized and evaluated analytically for constant element. To improve the timing-analysis efficiency of the finite-difference method, the dominant poles are obtained by introducing the Pade-via-Lanczos (PVL) algorithm for model-order reduction. Hence, it is easy to calculate the transient characteristics of both parallel conductors and complicated configurations such as crossing lines, corners, contacts, multilayers and their combinations. Therefore, a simple and more general method is proposed for solving the combinations of complex structures based on actual topography/processes and arbitrary geometric configurations of multilevel interconnection lines in order to link with the present CAD tools. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.en_US
dc.identifier.issn0038-1101en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/31857
dc.identifier.wosnumberWOS:000076523100017
dc.language.isoen_USen_US
dc.titleAn efficient transient modeling for 3-D multilevel interconnections in a stratified dielectric mediumen_US
dc.typeArticleen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
000076523100017.pdf
Size:
487.34 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: