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ANALYSIS OF THERMAL-STRESSES DUE TO MOVING FRICTIONAL LOAD IN AN INFINITE ELASTIC LAYERED MEDIUM

dc.citation.epage1248en_US
dc.citation.issue6en_US
dc.citation.spage1241en_US
dc.citation.volume32en_US
dc.citation.woscount1
dc.contributor.authorCHEN, LSen_US
dc.contributor.authorCHU, HSen_US
dc.contributor.authorWU, JHen_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.date.accessioned2014-12-08T15:05:53Z
dc.date.available2014-12-08T15:05:53Z
dc.date.issued1989en_US
dc.identifier.issn0045-7949en_US
dc.identifier.journalCOMPUTERS & STRUCTURESen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/4423
dc.identifier.wosnumberWOS:A1989AQ55800005
dc.language.isoen_USen_US
dc.titleANALYSIS OF THERMAL-STRESSES DUE TO MOVING FRICTIONAL LOAD IN AN INFINITE ELASTIC LAYERED MEDIUMen_US
dc.typeArticleen_US

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