微機電系統校際整合研究---子計畫六：蜂巢形撓性微型機構的設計

dc.contributor.author	徐文祥	en_US
dc.contributor.author	HSU WENSYANG	en_US
dc.contributor.department	國立交通大學機械工程學系	zh_TW
dc.date.accessioned	2014-12-13T10:38:45Z
dc.date.available	2014-12-13T10:38:45Z
dc.date.issued	1996	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC85-2215-E009-033	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=230190&docId=41824	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/95645
dc.language.iso	zh_TW	en_US
dc.subject	微致動器	zh_TW
dc.subject	蜂巢型撓性微機構	zh_TW
dc.subject	撓性接頭	zh_TW
dc.subject	靜電力	zh_TW
dc.subject	微機制	zh_TW
dc.subject	半導體製程	zh_TW
dc.subject	多晶矽薄膜	zh_TW
dc.subject	Microactuator	en_US
dc.subject	Honeycomb compliant micromechanism	en_US
dc.subject	Flexural joint	en_US
dc.subject	Electrostatic force	en_US
dc.subject	Micromachining	en_US
dc.subject	IC process	en_US
dc.subject	Polysilicon thin film	en_US
dc.title	微機電系統校際整合研究---子計畫六：蜂巢形撓性微型機構的設計	zh_TW
dc.title	Design of a Honeycomb Compliant Micromechanism	en_US
dc.type	Plan	en_US

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