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Low Operation Voltage InGaZnO Thin Film Transistors with LaAlO3 Gate Dielectric Incorporation

dc.citation.epageN181en_US
dc.citation.issue9en_US
dc.citation.spageN179en_US
dc.citation.volume2en_US
dc.citation.woscount0
dc.contributor.authorZheng, Z. W.en_US
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorChen, Y. C.en_US
dc.contributor.department光電系統研究所zh_TW
dc.contributor.departmentInstitute of Photonic Systemen_US
dc.date.accessioned2014-12-08T15:31:43Z
dc.date.available2014-12-08T15:31:43Z
dc.date.issued2013en_US
dc.description.abstractIn this paper, we report low operation voltage indium gallium zinc oxide (IGZO) thin film transistors (TFTs) incorporating a high-kappa lanthanum aluminum oxide (LaAlO3) as gate dielectric. Good TFT characteristics were achieved simultaneously, including a small subthreshold swing (SS) of 98 mV/dec, a low threshold voltage (V-t) of 0.29 V, a good on-off-state drive current ratio (I-on/I-off) of 1.1 x 10(5), and field effect mobility (mu(FE)) of 5.4 cm(2)/V . sec. These good performances are related to the high gate capacitance density and small equivalent oxide thickness (EOT) provided by the high-kappa LaAlO3 dielectric. Moreover, the effects of oxygen partial pressure during IGZO deposition process on the device characteristics were investigated. The small SS and low V-t allow the devices to be used at operation voltage as low as 1.5 V, which shows the great potential for future high speed and low power applications. (C) 2013 The Electrochemical Society. All rights reserved.en_US
dc.identifier.doi10.1149/2.020309jssen_US
dc.identifier.issn2162-8769en_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.020309jssen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/22433
dc.identifier.wosnumberWOS:000321620800006
dc.language.isoen_USen_US
dc.titleLow Operation Voltage InGaZnO Thin Film Transistors with LaAlO3 Gate Dielectric Incorporationen_US
dc.typeArticleen_US

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