<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Conformal deposition of Ni-P on anodic aluminum oxide template

dc.citation.epageD4en_US
dc.citation.issue1en_US
dc.citation.spageD1en_US
dc.citation.volume11en_US
dc.citation.woscount3
dc.contributor.authorLin, Sheng-Chiehen_US
dc.contributor.authorLai, Chun-Hanen_US
dc.contributor.authorWu, Pu-Weien_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:12:56Z
dc.date.available2014-12-08T15:12:56Z
dc.date.issued2008en_US
dc.description.abstractA nanoporous semiconducting template was fabricated by conformal deposition of Ni-P over anodic aluminum oxide (AAO). Electroless plating was conducted in repeated steps of sensitization, activation, and deposition using NaH2PO2 as a reducing agent. Variables including pH, temperature, time, and additive were studied for conformal deposition within the pore channels without clogging the openings prematurely. We demonstrated concentric Ni-P tubes with an inner diameter of 84 nm at 10 mu m length. Resistivity of the AAO template was determined at 39.6 Omega cm for through-channel direction. Incorporation of the semiconducting AAO structure with established template synthesis technologies opens up the opportunity for numerous devices. (C) 2007 The Electrochemical Society.en_US
dc.identifier.doi10.1149/1.2798921en_US
dc.identifier.issn1099-0062en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.2798921en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9981
dc.identifier.wosnumberWOS:000250983500009
dc.language.isoen_USen_US
dc.titleConformal deposition of Ni-P on anodic aluminum oxide templateen_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: