<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

EXAFS study of thermoelectric BiCuOSe: Effects of Cu vacancies

dc.citation.epage16en_US
dc.citation.spage12en_US
dc.citation.volume206en_US
dc.citation.woscount1en_US
dc.contributor.authorChou, Ta-Leien_US
dc.contributor.authorTewari, Girish C.en_US
dc.contributor.authorChan, Ting-Shanen_US
dc.contributor.authorHsu, Ying-Yaen_US
dc.contributor.authorYamauchi, Hisaoen_US
dc.contributor.authorKarppinen, Maariten_US
dc.contributor.department加速器光源科技與應用學位學程zh_TW
dc.contributor.departmentMaster and Ph.D. Program for Science and Technology of Accelrrator Light Sourceen_US
dc.date.accessioned2015-07-21T08:29:12Z
dc.date.available2015-07-21T08:29:12Z
dc.date.issued2015-03-01en_US
dc.description.abstractExcellent thermoelectric performance has been reported for the ZrCuSiAs-type BiCuOSe derivatives; for these materials the transport properties can be effectively adjusted by chemical substitutions or by introducing Cu vacancies. In this work we compare stoichiometric BiCuSeO and its Cu-deficient derivative BiCu0.95SeO by utilizing temperature dependent extended X-ray absorption fine structure (EXAFS) measurements. Such a local probe evidences that Cu vacancies make the lattice more ductile and susceptible to temperature variation. (C) 2015 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.ssc.2015.01.007en_US
dc.identifier.issn0038-1098en_US
dc.identifier.journalSOLID STATE COMMUNICATIONSen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ssc.2015.01.007en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/124311
dc.identifier.wosnumberWOS:000350109300003en_US
dc.language.isoen_USen_US
dc.subjectSemiconductorsen_US
dc.subjectEXAFSen_US
dc.subjectSynchrotron radiationen_US
dc.subjectX-ray spectroscopiesen_US
dc.titleEXAFS study of thermoelectric BiCuOSe: Effects of Cu vacanciesen_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: