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Improved luminance intensity of InGaN-GaN light-emitting diode by roughening both the p-GaN surface and the undoped-GaN surface

dc.citation.epageen_US
dc.citation.issue4en_US
dc.citation.volume89en_US
dc.citation.woscount49
dc.contributor.authorPeng, Wei Chihen_US
dc.contributor.authorWu, Yew Chung Sermonen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:16:11Z
dc.date.available2014-12-08T15:16:11Z
dc.date.issued2006-07-24en_US
dc.description.abstractThe InGaN-GaN epitaxial films were grown by low-pressure metal-organic chemical vapor deposition on a sapphire substrate, and then the light-emitting diode (LED) with double roughened (p-GaN and undoped-GaN) surfaces was fabricated by surface-roughening, wafer-bonding, and laser lift-off technologies. It was found that the front side luminance intensity of double roughened LED was 2.77 times higher than that of the conventional LED at an injection current of 20 mA. The backside luminance intensity was 2.37 times higher than that of the conventional LED. This is because the double roughened surfaces can provide photons multiple chances to escape from the LED surface, and redirect photons, which were originally emitted out of the escape cone, back into the escape cone.en_US
dc.identifier.doi10.1063/1.2236462en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2236462en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12015
dc.identifier.wosnumberWOS:000239376500016
dc.language.isoen_USen_US
dc.titleImproved luminance intensity of InGaN-GaN light-emitting diode by roughening both the p-GaN surface and the undoped-GaN surfaceen_US
dc.typeArticleen_US

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