化學氣相沉積擴散障礙層和鋁在極大型積體電路金屬連線之先導性研究(II)

dc.contributor.author	蘇翔	en_US
dc.contributor.department	國立交通大學電子工程學系	zh_TW
dc.date.accessioned	2014-12-13T10:39:09Z
dc.date.available	2014-12-13T10:39:09Z
dc.date.issued	1996	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC85-2215-E009-055	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=235104&docId=43197	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/96146
dc.language.iso	zh_TW	en_US
dc.subject	化學氣相沉積法	zh_TW
dc.subject	金屬化	zh_TW
dc.subject	極大型積體電路	zh_TW
dc.subject	鋁	zh_TW
dc.subject	CVD	en_US
dc.subject	Metallization	en_US
dc.subject	ULSI	en_US
dc.subject	Aluminum	en_US
dc.title	化學氣相沉積擴散障礙層和鋁在極大型積體電路金屬連線之先導性研究(II)	zh_TW
dc.title	Chemical Vapor Deposition of Barrier Metal and Aluminum for ULSI Metallization (II)	en_US
dc.type	Plan	en_US

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