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Tungsten oxide/tungsten nanocrystals for nonvolatile memory devices

dc.citation.epageen_US
dc.citation.issue1en_US
dc.citation.volume92en_US
dc.citation.woscount15
dc.contributor.authorChen, C. H.en_US
dc.contributor.authorChang, T. C.en_US
dc.contributor.authorLiao, I. H.en_US
dc.contributor.authorXi, P. B.en_US
dc.contributor.authorHsieh, Joeen_US
dc.contributor.authorChen, Jasonen_US
dc.contributor.authorHuang, Tensoren_US
dc.contributor.authorSze, S. M.en_US
dc.contributor.authorChen, U. S.en_US
dc.contributor.authorChen, J. R.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:12:42Z
dc.date.available2014-12-08T15:12:42Z
dc.date.issued2008-01-07en_US
dc.description.abstractIn this work, the fabrication of WO(3)/W nanocrystals for nonvolatile memory devices has been achieved via rapid thermal oxidation of tungsten silicide. Amorphous Si and WSi(x) (x=2.7) layers were deposited onto the tunneling oxide and sequentially oxidized to form well-shaped WO(3)/W nanocrystals. The mean size of WO(3)/W nanocrystals is similar to 8.4 nm, while density is similar to 1.57x10(11) cm(-2). Moreover, the nonvolatile memory device for WO(3)/W nanocrystals exhibits similar to 0.53 V threshold voltage shift under 1 V/(-5 V) operation. The sample without capping a-Si layer was also fabricated for comparison. By material analyses, reasonable formation mechanisms are proposed in this letter. (C) 2008 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2822401en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2822401en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9773
dc.identifier.wosnumberWOS:000252284200144
dc.language.isoen_USen_US
dc.titleTungsten oxide/tungsten nanocrystals for nonvolatile memory devicesen_US
dc.typeArticleen_US

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