INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES
| dc.citation.epage | 274 | en_US |
| dc.citation.issue | 2 | en_US |
| dc.citation.spage | 267 | en_US |
| dc.citation.volume | 13 | en_US |
| dc.citation.woscount | 22 | |
| dc.contributor.author | CHIOU, BS | en_US |
| dc.contributor.author | LIU, KC | en_US |
| dc.contributor.author | DUH, JG | en_US |
| dc.contributor.author | PALANISAMY, PS | en_US |
| dc.contributor.department | 電控工程研究所 | zh_TW |
| dc.contributor.department | Institute of Electrical and Control Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:05:34Z | |
| dc.date.available | 2014-12-08T15:05:34Z | |
| dc.date.issued | 1990-06-01 | en_US |
| dc.identifier.doi | 10.1109/33.56156 | en_US |
| dc.identifier.issn | 0148-6411 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/33.56156 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/4098 | |
| dc.identifier.wosnumber | WOS:A1990DG96600004 | |
| dc.language.iso | en_US | en_US |
| dc.title | INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES | en_US |
| dc.type | Article | en_US |