DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .1. LOW-K DIELECTRIC
| dc.citation.epage | 797 | en_US |
| dc.citation.issue | 4 | en_US |
| dc.citation.spage | 789 | en_US |
| dc.citation.volume | 12 | en_US |
| dc.citation.woscount | 4 | |
| dc.contributor.author | CHIOU, BS | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | 電控工程研究所 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.contributor.department | Institute of Electrical and Control Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:05:43Z | |
| dc.date.available | 2014-12-08T15:05:43Z | |
| dc.date.issued | 1989-12-01 | en_US |
| dc.identifier.doi | 10.1109/33.49048 | en_US |
| dc.identifier.issn | 0148-6411 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/33.49048 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/4256 | |
| dc.identifier.wosnumber | WOS:A1989CK70700054 | |
| dc.language.iso | en_US | en_US |
| dc.title | DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .1. LOW-K DIELECTRIC | en_US |
| dc.type | Article | en_US |