以自組裝奈米孔洞SiO/sub 2/作為次70 nm IC技術之超低介電薄膜之應用研究(III)
| dc.contributor.author | 潘扶民 | en_US |
| dc.contributor.author | PAN FU-MING | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:30:34Z | |
| dc.date.available | 2014-12-13T10:30:34Z | |
| dc.date.issued | 2005 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC94-2215-E009-007 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1143844&docId=219366 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/90332 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 以自組裝奈米孔洞SiO/sub 2/作為次70 nm IC技術之超低介電薄膜之應用研究(III) | zh_TW |
| dc.title | Self-Assembly Nanoporous Silica as an Ultra-Low K Dielectric for Sub-70 nm IC Technologies(III) | en_US |
| dc.type | Plan | en_US |