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Electrical characteristics of low temperature polysilicon TFT with a novel TEOS/oxynitride stack gate dielectric

dc.citation.epage514en_US
dc.citation.issue8en_US
dc.citation.spage512en_US
dc.citation.volume24en_US
dc.citation.woscount30
dc.contributor.authorChang, KMen_US
dc.contributor.authorYang, WCen_US
dc.contributor.authorTsai, CPen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:40:32Z
dc.date.available2014-12-08T15:40:32Z
dc.date.issued2003-08-01en_US
dc.description.abstractThis investigation is the first to demonstrate a novel tetraethylorthosilicate. (TEOS)/oxynitride stack gate dielectric for low-temperature poly-Si (LTPS) thin film transistors (TFTs), composed, of a plasma-enhanced chemical vapor deposition (PECVD) thick TEOS oxide/ultrathin oxynitride grown by. PECVD N2O-plasma. The stack oxide shows a very high electrical breakdown field of 8.4 MV/cm, which is approximately 3 MV/cm larger than traditional PECVD TEOS oxide. The field effective mobility of stack oxide UPS TFTs is over 4 times than that of traditional TEOS oxide UPS TFTs. these. improvements are attributed to the high quality N2O-plasma grown ultrathin oxynitride forming strong Si drop N bonds, as well as to reduce the trap density in the dxynitride/poly-Si interface.en_US
dc.identifier.doi10.1109/LED.2003.815155en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2003.815155en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27668
dc.identifier.wosnumberWOS:000184514400006
dc.language.isoen_USen_US
dc.subjectN2O-plasma oxynitrideen_US
dc.subjectstack oxideen_US
dc.subjectthin film transistors (TFTs)en_US
dc.titleElectrical characteristics of low temperature polysilicon TFT with a novel TEOS/oxynitride stack gate dielectricen_US
dc.typeArticleen_US

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