Dual-bandpass filters with serial configuration using LTCC technology

dc.citation.epage2328en_US
dc.citation.issue6en_US
dc.citation.spage2321en_US
dc.citation.volume54en_US
dc.citation.woscount15
dc.contributor.authorLin, KCen_US
dc.contributor.authorChang, CFen_US
dc.contributor.authorWu, MCen_US
dc.contributor.authorChung, SJen_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.date.accessioned2014-12-08T15:16:28Z
dc.date.available2014-12-08T15:16:28Z
dc.date.issued2006-06-01en_US
dc.description.abstractA dual-bandpass filter that utilizes a serial configuration of the inductive coupled-line (ICL) filter and the capacitive coupled-line (CCL) filter is investigated in this study. Numerical analysis is presented for the difference between the ICL and CCL filters. The dual-bandpass filter has a similar behavior to the individual single-band filter around the corresponding passband. An extra transmission zero can be generated between the two pass-bands of the dual-bandpass filter in that the ICL and CCL filters exhibit an out-of-phase response. Four architectures of dual-bandpass filters are proposed for the 2.4/5-GHz systems. Two of them are demonstrated by the low-temperature co-fired ceramic multilayer technology. Measurements results agree quite well with the simulation ones.en_US
dc.identifier.doi10.1109/TMTT.2006.875267en_US
dc.identifier.issn0018-9480en_US
dc.identifier.journalIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TMTT.2006.875267en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12179
dc.identifier.wosnumberWOS:000238318700004
dc.language.isoen_USen_US
dc.subjectbandpass filteren_US
dc.subjectdual-banden_US
dc.subjectlow-temperature co-fired ceramic (LTCC)en_US
dc.subjectwireless local area network (WLAN)en_US
dc.titleDual-bandpass filters with serial configuration using LTCC technologyen_US
dc.typeArticleen_US

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