Chemical formation of palladium-free surface-nickelized polyimide film for flexible electronics

Abstract

Flexible polyimide (PI) films for flexible electronics were surface-nickelized using a fully solution-based process and excellent adhesion between the nickel and polyimide phases was observed. Polyimide substrates were modified by alkaline hydrolysis, ion exchange, reduction and nickel electroless deposition without palladium. Atomic force microscopy and field emission scanning electron microscopy were used to follow the growth of nickel nanoparticles (Ni-NPs) and nickel layers on the polyimide surface. The surface resistances of the Ni-NPs/PI films and Ni/PI films, measured using a four-point probe, were 1.6x10(7) and 0.83 Omega/cm(2), respectively. The thicknesses of Ni-NPs and the Ni layer on the polyimide surface were 82 nm and 382 nm, respectively, as determined by transmission electron microscopy, and the Ni layer adhered well to PI, as determined by the adhesive tape testing method. (c) 2008 Elsevier B.V. All rights reserved.