介電層之化學機械拋光漿料與製程設計---子計畫III：積體電路製程中介電層薄膜之材料特性與化學機械拋光之研究
| dc.contributor.author | 曾偉志 | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:03Z | |
| dc.date.available | 2014-12-13T10:37:03Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-2216-E006-046 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=418291&docId=74210 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94342 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 化學機械拋光法 | zh_TW |
| dc.subject | 介電質內薄膜 | zh_TW |
| dc.subject | 極大型積體電路 | zh_TW |
| dc.subject | Chemical-mechanical polishing (CMP) | en_US |
| dc.subject | Intern layer dielectrics (ILD) | en_US |
| dc.subject | Ultra large scaling integration (ULSI) | en_US |
| dc.title | 介電層之化學機械拋光漿料與製程設計---子計畫III：積體電路製程中介電層薄膜之材料特性與化學機械拋光之研究 | zh_TW |
| dc.title | Materials Characteristics and Chemical-Mechanical Polishing Process of Inter-Layer Dielectric Thin Films for Integrated Circuits Fabrication | en_US |
| dc.type | Plan | en_US |