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Study of nickel silicide contact on Si/Si1-xGex

dc.citation.epage546en_US
dc.citation.issue9en_US
dc.citation.spage544en_US
dc.citation.volume24en_US
dc.citation.woscount13
dc.contributor.authorYang, THen_US
dc.contributor.authorLuo, GLen_US
dc.contributor.authorChang, EYen_US
dc.contributor.authorYang, TYen_US
dc.contributor.authorTseng, HCen_US
dc.contributor.authorChang, CYen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
dc.date.accessioned2014-12-08T15:40:23Z
dc.date.available2014-12-08T15:40:23Z
dc.date.issued2003-09-01en_US
dc.description.abstractThe properties of nickel silicide formed by depositing nickel on Si/P+ - Si1-xGex layer are compared with that of nickel germanosilicide on P+ - Si1-xGex layer formed by depositing Ni directly on P+ - Si1-xGex layer without silicon consuming layer. After thermal annealing, nickel silicide on Si/P+ S Si1-xGex layer shows lower sheet resistance and specific contact resistivity than that of nickel germanosilicide on P+ - Si1-xGex layer. In addition, small junction leakage current is also observed for nickel silicide on Si/P+ - Si1-xGex/N - Si diode. In summary, witha Si consuming layer on top of the Si1-xGex, the nickel silicide contact formed demonstrated improved electrical and materials characteristics as compared with the nickel germanosilicide contact which was formed directly on Si1-xGex layer.en_US
dc.identifier.doi10.1109/LED.2003.815944en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2003.815944en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27569
dc.identifier.wosnumberWOS:000184924700006
dc.language.isoen_USen_US
dc.subjectagglomerateen_US
dc.subjectNien_US
dc.subjectSiGeen_US
dc.subjectsilicideen_US
dc.titleStudy of nickel silicide contact on Si/Si1-xGexen_US
dc.typeArticleen_US

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