ELECTROMAGNETIC SIMULATION OF VLSI CIRCUITS BY THE MODIFIED ADI-FDTD METHOD

dc.citation.epage2534en_US
dc.citation.issue11en_US
dc.citation.spage2530en_US
dc.citation.volume56en_US
dc.citation.woscount0
dc.contributor.authorHwang, Jiunn-Nanen_US
dc.contributor.authorChen, Fu-Chiarngen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:36:46Z
dc.date.available2014-12-08T15:36:46Z
dc.date.issued2014-11-01en_US
dc.description.abstractThe alternating direction implicit (ADI) finite-difference time-domain (FDTD) method can be used to simulate very large scale integration (VLSI) circuits efficiently as the time step is not restricted by the Courant-Friedrich-Levy stability condition. When the Berenger\'s split-field perfectly matched layer (PML) absorbing boundary condition is used for the ADI-FDTD method for open region simulation, the PML implementation will make this scheme unstable. In this article, the modified PML conductivity profiles are proposed to improve the stability of this scheme. Numerical simulations of the VLSI interconnect and RF inductor in time domain and frequency domain will be demonstrated to show the efficiency and accuracy of this method. (C) 2014 Wiley Periodicals, Inc.en_US
dc.identifier.doi10.1002/mop.28643en_US
dc.identifier.issn0895-2477en_US
dc.identifier.journalMICROWAVE AND OPTICAL TECHNOLOGY LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1002/mop.28643en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/25152
dc.identifier.wosnumberWOS:000341505400015
dc.language.isoen_USen_US
dc.subjectalternating-direction impliciten_US
dc.subjectfinite-difference time-domainen_US
dc.subjectperfectly matched layeren_US
dc.subjectmodified conductivity profileen_US
dc.subjectstabilityen_US
dc.titleELECTROMAGNETIC SIMULATION OF VLSI CIRCUITS BY THE MODIFIED ADI-FDTD METHODen_US
dc.typeArticleen_US

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