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EFFECTS OF HOT-CARRIER-INDUCED INTERFACE STATE GENERATION IN SUBMICRON LDD MOSFETS

dc.citation.epage1622en_US
dc.citation.issue9en_US
dc.citation.spage1618en_US
dc.citation.volume41en_US
dc.citation.woscount19
dc.contributor.authorWANG, THen_US
dc.contributor.authorHUANG, CMen_US
dc.contributor.authorCHOU, PCen_US
dc.contributor.authorCHUNG, SSSen_US
dc.contributor.authorCHANG, TEen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:03:47Z
dc.date.available2014-12-08T15:03:47Z
dc.date.issued1994-09-01en_US
dc.description.abstractA two-dimensional numerical simulation including a new interface state generation model has been developed to study the performance variation of a LDD MOSFET after a dc voltage stress. The spatial distribution of hot carrier induced interface states is calculated with a breaking silicon-hydrogen bond model. Mobility degradation and reduction of conduction charge due to interface traps are considered. A 0.6 mum LDD MOSFET was fabricated. The drain current degradation and the substrate current variation after a stress were characterized to compare the simulation. A reduction of the substrate current at V(g) congruent-to 0.5 V(d) in a stressed device was observed from both the measurement and the simulation. Our study reveals that the reduction is attributed to a distance between a maximum channel electric field and generated interface states.en_US
dc.identifier.doi10.1109/16.310115en_US
dc.identifier.issn0018-9383en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.310115en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/2333
dc.identifier.wosnumberWOS:A1994PE02600018
dc.language.isoen_USen_US
dc.titleEFFECTS OF HOT-CARRIER-INDUCED INTERFACE STATE GENERATION IN SUBMICRON LDD MOSFETSen_US
dc.typeArticleen_US

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