Effects of metallo-organic decomposition agents on thermal decomposition and electrical conductivity of low-temperature-curing silver paste

Abstract

Six low-temperature-curing silver pastes were prepared from silver flake, alpha-terpineol and, various metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were determined. The microstructures and resistivities of screen-printed films on alumina substrate after thermal treatment were characterized and discussed. Results indicated that 2-ethylhexanoate possesses the lowest decomposition temperature (190.3 degrees C) among the MOD agents studied, and it forms silver particles to promote the linking of silver flake powders and thus reduces the resistivity to < 13 mu Omega.cm at a temperature as low as 200 degrees C.