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Near-infrared femtosecond laser-induced crystallization of amorphous silicon

dc.citation.epage1234en_US
dc.citation.issue7en_US
dc.citation.spage1232en_US
dc.citation.volume85en_US
dc.citation.woscount48
dc.contributor.authorShieh, JMen_US
dc.contributor.authorChen, ZHen_US
dc.contributor.authorDai, BTen_US
dc.contributor.authorWang, YCen_US
dc.contributor.authorZaitsev, Aen_US
dc.contributor.authorPan, CLen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:38:41Z
dc.date.available2014-12-08T15:38:41Z
dc.date.issued2004-08-16en_US
dc.description.abstractAmorphous silicon (a-Si) was crystallized by femtosecond laser annealing (FLA) using a near-infrared (lambdaapproximate to800 nm) ultrafast Ti:sapphire laser system. The intense ultrashort laser pulses lead to efficient nonlinear photoenergy absorption and the generation of very dense photoexcited plasma in irradiated materials, enabling nonlinear melting on transparent silicon materials. We studied the structural characteristics of recrystallized films and found that FLA assisted by spatial scanning of laser strip spot constitutes superlateral epitaxy that can crystallize a-Si films with largest grains of similar to800 nm, requiring laser fluence as low as similar to45 mJ/cm(2), and low laser shots. Moreover, the optimal annealing conditions are observed with a significant laser-fluence window (similar to30%). (C) 2004 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.1782267en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1782267en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/26470
dc.identifier.wosnumberWOS:000223233800047
dc.language.isoen_USen_US
dc.titleNear-infrared femtosecond laser-induced crystallization of amorphous siliconen_US
dc.typeArticleen_US

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