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Improvement of diamond film adhesion on cemented carbides (WC/Co) by using Ti and micro-diamonds as seeding germination

dc.citation.epage390en_US
dc.citation.issue3en_US
dc.citation.spage385en_US
dc.citation.volume38en_US
dc.citation.woscount1
dc.contributor.authorLin, CRen_US
dc.contributor.authorKuo, CTen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:01:07Z
dc.date.available2014-12-08T15:01:07Z
dc.date.issued1998-01-06en_US
dc.identifier.issn1359-6462en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/37
dc.identifier.wosnumberWOS:000071739900005
dc.language.isoen_USen_US
dc.titleImprovement of diamond film adhesion on cemented carbides (WC/Co) by using Ti and micro-diamonds as seeding germinationen_US
dc.typeArticleen_US

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