Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
| dc.citation.epage | en_US | |
| dc.citation.issue | 8 | en_US |
| dc.citation.volume | 90 | en_US |
| dc.citation.woscount | 16 | |
| dc.contributor.author | Liang, S. W. | en_US |
| dc.contributor.author | Chiu, S. H. | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:14:40Z | |
| dc.date.available | 2014-12-08T15:14:40Z | |
| dc.date.issued | 2007-02-19 | en_US |
| dc.description.abstract | This study investigates the mechanism for the abrupt increase in temperature at later stages of electromigration in flip-chip solder joints. It is found that electromigration also occurs in Al traces when stressed by 0.6 A at 100 degrees C. Three-dimensional thermoelectrical simulation by finite element analysis was carried out to simulate the temperature distribution in solder joints with and without degradation of the Al trace. It is found that the degradation of the Al trace has substantial effect on the Joule heating of solder joints. This model can explain the serious Joule heating effect in the later stages of electromigration. (c) 2007 American Institute of Physics. | en_US |
| dc.identifier.doi | 10.1063/1.2644061 | en_US |
| dc.identifier.issn | 0003-6951 | en_US |
| dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1063/1.2644061 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/11118 | |
| dc.identifier.wosnumber | WOS:000244420600041 | |
| dc.language.iso | en_US | en_US |
| dc.title | Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints | en_US |
| dc.type | Article | en_US |