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Arsenic-Implanted HfON Charge-Trapping Flash Memory With Large Memory Window and Good Retention

dc.citation.epage383en_US
dc.citation.issue3en_US
dc.citation.spage381en_US
dc.citation.volume32en_US
dc.citation.woscount6
dc.contributor.authorTsai, C. Y.en_US
dc.contributor.authorLee, T. H.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:12:03Z
dc.date.available2014-12-08T15:12:03Z
dc.date.issued2011-03-01en_US
dc.description.abstractWe have fabricated the TaN-[SiO(2)-LaAlO(3)]-HfON-[LaAlO(3)-SiO(2)]-Si charge-trapping Flash device. A large 6.4-V initial memory window, a 4.3-V 10-year extrapolated retention window at 125 degrees C, and a 5.5-V endurance window at 10(6) cycles were measured under very fast 100-mu s and low +/- 16-V program/erase. These excellent results were achieved using an As(+) implant into the HfON trapping layer, which were significantly better than those of the control device without ion implantation.en_US
dc.identifier.doi10.1109/LED.2010.2100019en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2010.2100019en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9240
dc.identifier.wosnumberWOS:000287658400053
dc.language.isoen_USen_US
dc.subjectCharge-trapping Flash (CTF)en_US
dc.subjectHfONen_US
dc.subjection implanten_US
dc.subjectnonvolatile memory (NVM)en_US
dc.titleArsenic-Implanted HfON Charge-Trapping Flash Memory With Large Memory Window and Good Retentionen_US
dc.typeArticleen_US

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