Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
| dc.citation.epage | en_US | |
| dc.citation.issue | 17 | en_US |
| dc.citation.volume | 88 | en_US |
| dc.citation.woscount | 29 | |
| dc.contributor.author | Liang, SW | en_US |
| dc.contributor.author | Chang, YW | en_US |
| dc.contributor.author | Chen, C | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:16:48Z | |
| dc.date.available | 2014-12-08T15:16:48Z | |
| dc.date.issued | 2006-04-24 | en_US |
| dc.description.abstract | Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 degrees C, we estimate that the MTTF of the joints with Al traces in 100 mu m width was 6.1 times longer than that of joints with Al traces in 34 mu m width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF. (c) 2006 American Institute of Physics. | en_US |
| dc.identifier.doi | 10.1063/1.2198809 | en_US |
| dc.identifier.issn | 0003-6951 | en_US |
| dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1063/1.2198809 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/12356 | |
| dc.identifier.wosnumber | WOS:000237136600038 | |
| dc.language.iso | en_US | en_US |
| dc.title | Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration | en_US |
| dc.type | Article | en_US |