Evaluation of Cu-bumps with lead-free solders for flip-chip package applications
| dc.citation.epage | 2395 | en_US |
| dc.citation.issue | 12 | en_US |
| dc.citation.spage | 2392 | en_US |
| dc.citation.volume | 86 | en_US |
| dc.citation.woscount | 10 | |
| dc.contributor.author | Lin, Kung-Liang | en_US |
| dc.contributor.author | Chang, Edward-Yi | en_US |
| dc.contributor.author | Shih, Lin-Chi | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:08:10Z | |
| dc.date.available | 2014-12-08T15:08:10Z | |
| dc.date.issued | 2009-12-01 | en_US |
| dc.description.abstract | Low cost electroplated Cu-bump with environmental friendly Sn solder was developed for flip-chip applications. The seed layer used was Ti/WN(x)/Ti/Cu where WN(x) was used as the Cu diffusion barrier and Ti was used to enhance the adhesion between bump and the chip pad. Thick negative photoresist (THB JSR-151N) with a high aspect ratio of 2.4 was used for electroplating of copper bump and Sn solder. The Sn solder cap was reflowed at 225 degrees for 6 min at N(2) atmosphere. No wetting phenomenon was observed for the Sn solder as evaluated by energy-dispersed spectroscopy (EDS). The Cu-bump with Ti/WN(x)/Ti/Cu seed layer not only have higher shear force than the Cu-bump with Ti/Cu seed layer but also has higher resistance to fatigue failure than the Au, SnCu, SnAg bumps. (C) 2009 Elsevier B.V. All rights reserved. | en_US |
| dc.identifier.doi | 10.1016/j.mee.2009.04.027 | en_US |
| dc.identifier.issn | 0167-9317 | en_US |
| dc.identifier.journal | MICROELECTRONIC ENGINEERING | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/j.mee.2009.04.027 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/6376 | |
| dc.identifier.wosnumber | WOS:000271846900005 | |
| dc.language.iso | en_US | en_US |
| dc.subject | Copper bump | en_US |
| dc.subject | Lead-free | en_US |
| dc.subject | Electroplating | en_US |
| dc.title | Evaluation of Cu-bumps with lead-free solders for flip-chip package applications | en_US |
| dc.type | Article | en_US |