高密度電子構裝接合與測試載具之開發---總計畫(III)
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 交通大學電子工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:08Z | |
| dc.date.available | 2014-12-13T10:37:08Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-2216-E009-011 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=429228&docId=76835 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94408 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 電子封裝 | zh_TW |
| dc.subject | 多晶片模組 | zh_TW |
| dc.subject | 多層連線結構 | zh_TW |
| dc.subject | 基板製造 | zh_TW |
| dc.subject | 晶片接合 | zh_TW |
| dc.subject | Electronic package | en_US |
| dc.subject | Multichip model (MCM) | en_US |
| dc.subject | Multilayer interconnection structure | en_US |
| dc.subject | Substrate fabrication | en_US |
| dc.subject | Chip interconnection | en_US |
| dc.title | 高密度電子構裝接合與測試載具之開發---總計畫(III) | zh_TW |
| dc.title | A Development of Bonding Technology and Test Vehicle for High-Density Electronic Packaging (III) | en_US |
| dc.type | Plan | en_US |