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Accurate modeling and characterization of mobility in tensile and compressive stress for state-of-the-art manufacturing NMOSFETs

dc.citation.epage+en_US
dc.citation.spage158en_US
dc.citation.woscount0en_US
dc.contributor.authorWang, J. -S.en_US
dc.contributor.authorChen, William P. N.en_US
dc.contributor.authorShih, C. -H.en_US
dc.contributor.authorLien, C.en_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorSheu, Y. M.en_US
dc.contributor.authorChao, Donald Y. -S.en_US
dc.contributor.authorGoto, K.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2017-04-21T06:49:08Z
dc.date.available2017-04-21T06:49:08Z
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0584-8en_US
dc.identifier.journal2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/135150
dc.identifier.wosnumberWOS:000247059300072en_US
dc.language.isoen_USen_US
dc.titleAccurate modeling and characterization of mobility in tensile and compressive stress for state-of-the-art manufacturing NMOSFETsen_US
dc.typeProceedings Paperen_US

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