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RF CMOS technology for MMIC

dc.citation.epage733en_US
dc.citation.issue4-5en_US
dc.citation.spage721en_US
dc.citation.volume42en_US
dc.citation.woscount9
dc.contributor.authorChang, CYen_US
dc.contributor.authorSu, JGen_US
dc.contributor.authorWong, SCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorSun, YCen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:42:33Z
dc.date.available2014-12-08T15:42:33Z
dc.date.issued2002-04-01en_US
dc.description.abstractThis paper presents a high performance RF CMOS technology with a complete portfolio of RF and base band components for single-chip systems. Using an optimized 0.13 mum CMOS topology, f(T) of 86 GHz and f(max) of 73 GHz are obtained, in addition to a NFmin of 1.5 dB without ground-shielded signal pad. The high-Q accumulation-mode and diode varactors are optimized to perform a high tuning range of 47% and 25%, respectively. Inductors with a quality factor of 18 at 1.7 nH are obtained using copper interconnect, while capacitors with high unit capacitance and quality factor are fabricated with metal-insulator-metal structures. Finally, a deep n-well isolation is adopted to suppress the interblock coupling noise penetrating through substrate by 40 and 25 dB at 0.1 and 2.4 GHz, respectively. These results clearly demonstrate that CMOS technology can provide a complete solution for single-chip wireless systems. (C) 2002 Elsevier Science Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/S0026-2714(02)00006-9en_US
dc.identifier.issn0026-2714en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0026-2714(02)00006-9en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/28891
dc.identifier.wosnumberWOS:000176465800021
dc.language.isoen_USen_US
dc.titleRF CMOS technology for MMICen_US
dc.typeArticleen_US

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