三維積體電路(3D IC)之矽晶直通孔(TSV)與其它關鍵技術製程整合研究及應力量測熱傳導模型分析( III )

dc.contributor.author	陳冠能	en_US
dc.contributor.author	CHEN KUAN-NENG	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
dc.date.accessioned	2014-12-13T10:41:21Z
dc.date.available	2014-12-13T10:41:21Z
dc.date.issued	2012	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC101-2628-E009-005	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2645670&docId=399140	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/98389
dc.language.iso	zh_TW	en_US
dc.title	三維積體電路(3D IC)之矽晶直通孔(TSV)與其它關鍵技術製程整合研究及應力量測熱傳導模型分析( III )	zh_TW
dc.title	Studies of through Silicon VI a (Tsv) and Other Key Technologies in Three-Dimensional Integrated Circuit (3d Ic) with Stress Analysis and Thermal Conductivity Modeling	en_US
dc.type	Plan	en_US

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